Duocel® Copper Foam ***THIS PRODUCT IS NOT AVALIBLE AT THIS TIME***
- Optimal Heat Transfer
- High Strength to Weight Ratio
- High Surface area to Volume Ratio
- isotropic load response
- controlled stress-strain Characteristics
- Can be coated and plated
|PPI Available||5, 10, 20,
|Largest starting material sizes:||Call or Email for more details|
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Why is Duocel® copper foam so special?
Duocel® copper foam is a true metal skeletal structure. It is not a sintered, coated, or plated product. Its purity is typically that of the parent alloy metal, with no voids, inclusions, or entrapments.
The matrix of cells and ligaments is completely repeatable, regular, and uniform throughout the entirety of the material. Duocel® copper foam is a rigid, highly porous and permeable structure and has a controlled density of metal per unit volume.
Physical Characteristics of Duocel® Copper Foam* (8% Nominal Density C10100)
|Compression Strength||131 psi||(0.903 MPa)|
|Tensile Strength*||1000 psi||(6.9 MPa)|
|Shear Strength||190 psi||(1.31 MPa)|
|Modulus of Elasticity (Compression)*||107 kpsi||(736 MPa)|
|Modulus of Elasticity (Tension)*||14.6 × 103 psi||(101.84 MPa)|
|Shear Modulus||40.9 kpsi||(282 MPa)|
|Specific Heat||0.092 BTU/lb-°F||(0.385 J/g-C)|
|Bulk Thermal Conductivity||5.84 BTU/ft-hr-F||(10.1 W/m-C)|
|Coefficient of Thermal Expansion (0-100°C)||9.44× 10-6 in/in--F||(1.7 × 10-5 m/m--C)|
|Bulk Resistivity||2.56× 10-5 ohm - in||(6.5 × 10-5 ohm - cm)|
*these values were derived from small samples where edge effects influenced the results. Larger samples having a minimum of 10-15 bubble diameter produce more general test results which are in better compliance with the equations.
Thermal Conductivity Copper has anextremely high thermal conductivity. Duocel® copper foam is used in very high performance heat exchangers where weight and cost are of low priority. Because of the greater surface area of Duocel® copper foam heat transfer to fluids flowing through the foam is greatly accelerated over solid copper and copper fins.Please visit our thermal conductivity page in the technical data section for a more in depth explanation of how materials and properties effects the thermal conductivity of Duocel® foam.
When a load is applied to a foam structure, it will initially yield elastically in accord with the Young‘s modulus equation. However, at approximately 4-6% of strain, depending on the sample size, the foam structure will begin to buckle and collapse continuously at a relatively constant stress. Depending upon the initial relative density of the foam, this constant collapse will proceed to approximately 50-70% of strain. At that point, the stress / strain curve will begin to rise as the compressed foam enters the "densification" phase.
The point in the stress / strain curve where it transitions from the elastic to plastic deformation phase defines the "crush strength" of the foam. This is an important mechanical parameter as it is obviously essential to remain below that level for any structure that is being designed to maintain its shape under design load.
Please visit our energy absorption page in the technical data section for a more in depth explanation of how materials and properties effects the crush strength of Duocel® foam.
Please visit our electrical conductivity page in the technical data section for a more in depth explanation of how materials and properties effects the electrical conductivity of Duocel® foam.
Duocel® copper foam is limited to 1" x 6" x 18" continuous pieces. Smaller pore size may also limit the thickness of panels. Larger sizes can be achieved through bonding, brazing, or other assembly methods.
Be aware that ERG DOES NOT sell raw, bulk materials. We only sell finished end item products.